1. Application of fracture mechanics in electronic packaging and materials : presented at the International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, Claifornia
المؤلف: sponsored by the electrical and Electronic Packaging Division, ASME, The Materials Division, ASME ; edited by Tien Y. Wu ... ]et al.[
المکتبة: (طهران)
موضوع: Electronic packaging - Materials - Congresses , Materials - Electric properties - Congresses
رده :
TK
7870
.
15
.
A85
1995
